Atomizer and electronic atomization device having same

ABSTRACT

A vaporizer includes: a liquid storage tank for storing liquid; a mounting base including a leaked liquid buffer structure having a capillary force; and a vaporization core including a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and absorbing liquid from the liquid storage tank through a capillary force, the heating element heating and vaporizing the liquid of the porous substrate. The vaporization core is located between the liquid storage tank and the leaked liquid buffer structure. The leaked liquid buffer structure abuts the porous substrate and receives the liquid overflowed from the porous substrate.

CROSS-REFERENCE TO PRIOR APPLICATION

This application is a continuation of International Patent Application No. PCT/CN2020/114889, filed on Sep. 11, 2020. The entire disclosure is hereby incorporated by reference herein.

FIELD

This application relates to the field of vaporization device technologies, and in particular, to a vaporizer and an electronic vaporization device thereof.

BACKGROUND

A vaporizer is a device that vaporizes vaporizable liquid such as e-liquid and is widely applied to fields such as electronic vaporization devices and medical care. In the related art, after a vaporizer in an electronic vaporization device stores e-liquid, in a temperature change process of a cartridge, there are bubbles in a liquid storage tank, and thermal expansion and cold contraction of the bubbles press out the e-liquid in the liquid storage tank. As a result, the e-liquid leaks out from an air inlet passage at a bottom of the vaporizer, affecting the entire experience of the vaporizer.

SUMMARY

In an embodiment, the present invention provides a vaporizer, comprising: a liquid storage tank configured to store liquid; a mounting base comprising a leaked liquid buffer structure having a capillary force; and a vaporization core comprising a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and configured to absorb liquid from the liquid storage tank through a capillary force, the heating element being configured to heat and vaporize the liquid of the porous substrate, wherein the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure, and wherein the leaked liquid buffer structure abuts the porous substrate and is configured to receive the liquid overflowed from the porous substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Subject matter of the present disclosure will be described in even greater detail below based on the exemplary figures. All features described and/or illustrated herein can be used alone or combined in different combinations. The features and advantages of various embodiments will become apparent by reading the following detailed description with reference to the attached drawings, which illustrate the following:

FIG. 1 is a schematic structural diagram of an electronic vaporization device according to this application;

FIG. 2 is a schematic structural diagram of a vaporizer in an electronic vaporization device according to this application;

FIG. 3 is an enlarged schematic structural diagram of a position A in FIG. 2 ;

FIG. 4 is a schematic structural diagram of a first embodiment of a leaked liquid buffer structure according to this application;

FIG. 5 is a schematic structural diagram of a second embodiment of a leaked liquid buffer structure according to this application;

FIG. 6 is a schematic structural diagram of a third embodiment of a leaked liquid buffer structure according to this application;

FIG. 7 is a schematic structural diagram of a fourth embodiment of a leaked liquid buffer structure according to this application;

FIG. 8 is a top view of the leaked liquid buffer structure provided in FIG. 7 ;

FIG. 9 is a schematic structural diagram of a fifth embodiment of a leaked liquid buffer structure according to this application;

FIG. 10 is a schematic phenomenon diagram of a vaporizer in a heating process according to this application;

FIG. 11 is a schematic phenomenon diagram of a vaporizer in a cooling process according to this application; and

FIG. 12 is a schematic structural diagram of a sixth embodiment of a leaked liquid buffer structure according to this application.

DETAILED DESCRIPTION

In an embodiment, the present invention provides a vaporizer and an electronic vaporization device thereof, to resolve the problem of liquid leakage of vaporizers in the related art.

In an embodiment, the present invention provides a vaporizer, including: a liquid storage tank, configured to store liquid; a mounting base, including a leaked liquid buffer structure having a capillary force; and a vaporization core, including a porous substrate and a heating element, where the porous substrate is in fluid communication with the liquid storage tank and absorbs liquid from the liquid storage tank through a capillary force; the heating element heats and vaporizes the liquid of the porous substrate; the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure; and the leaked liquid buffer structure abuts against the porous substrate and is configured to receive the liquid overflowed from the porous substrate.

The capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.

The mounting base includes a vaporization cavity, the vaporization core is accommodated in the vaporization cavity, and the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and absorbs liquid deposited at the bottom of the vaporization cavity through a capillary force.

The mounting base includes an upper base body and a lower base body, a liquid flowing hole is provided on the upper base body, the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole, the leaked liquid buffer structure is provided on the lower base body, the porous substrate includes a liquid absorbing surface and a vaporization surface, the liquid absorbing surface is connected to the liquid flowing hole, the heating element is provided on the vaporization surface, and surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.

When an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate, so that the porous substrate overflows redundant liquid, and the leaked liquid buffer structure receives and locks the redundant liquid; and when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate.

The leaked liquid buffer structure includes a first capillary groove, one end of the first capillary groove is in contact with the porous substrate, and another end of the first capillary groove extends to the bottom of the vaporization cavity.

The leaked liquid buffer structure further includes a second capillary groove provided on the bottom of the vaporization cavity, and the second capillary groove is in communication with the first capillary groove.

The leaked liquid buffer structure includes a capillary hole, one end of the capillary hole is in contact with the porous substrate, and another end of the capillary hole extends to the bottom of the vaporization cavity.

The leaked liquid buffer structure further includes a second capillary groove provided on the bottom of the vaporization cavity, and the second capillary groove is in communication with the capillary hole.

A material of the leaked liquid buffer structure is a porous material.

The porous material is a hard porous material, and the leaked liquid buffer structure is configured to support the vaporization core. The leaked liquid buffer structure is a U-shaped structure.

The hard porous material is at least one of a porous ceramic or a porous metal.

The porous material is a soft porous material, the leaked liquid buffer structure is supported by a support portion, so that one end of the leaked liquid buffer structure is in contact with the porous substrate, and another end extends to the bottom of the vaporization cavity.

The soft porous material is at least one of cotton, fiber, or liquid absorbing resin.

The porous substrate includes an e-liquid transmission portion and a protruding portion integrally formed on one side of the e-liquid transmission portion, and the leaked liquid buffer structure is provided on an edge of the e-liquid transmission portion and provided at intervals with the protruding portion.

The porous substrate is made of any one of a porous ceramic or a porous metal.

To resolve the foregoing technical problem, a second technical solution adopted by this application is to provide an electronic vaporization device, including a power supply component and the vaporizer described above.

To resolve the foregoing technical problem, a third technical solution adopted by this application is to provide an electronic vaporization device, including a liquid storage tank, a mounting base, a vaporization core, and a power supply component, where the liquid storage tank is configured to store liquid; the mounting base includes a leaked liquid buffer structure having a capillary force; and the vaporization core includes a porous substrate and a heating element, where the porous substrate is in fluid communication with the liquid storage tank and absorbs liquid from the liquid storage tank through a capillary force; and the heating element heats and vaporizes the liquid of the porous substrate; and the power supply component is configured to supply power to the vaporization core, where the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure; and the leaked liquid buffer structure abuts against the porous substrate and is configured to receive the liquid overflowed from the porous substrate.

The capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.

The mounting base includes a vaporization cavity, the vaporization core is accommodated in the vaporization cavity, and the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and absorbs liquid deposited at the bottom of the vaporization cavity through a capillary force.

The mounting base includes an upper base body and a lower base body, the upper base body is provided with a liquid flowing hole, the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole, the leaked liquid buffer structure is provided on the lower base body, the porous substrate includes a liquid absorbing surface and a vaporization surface provided opposite to each other, the liquid absorbing surface is connected to the liquid flowing hole, the heating element is provided on the vaporization surface, and surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.

When an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate, so that the porous substrate overflows redundant liquid, and the leaked liquid buffer structure receives and locks the redundant liquid; and when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate.

This application has the following beneficial effects: different from the related art, a vaporizer and an electronic vaporization device thereof are provided. The vaporizer includes: a liquid storage tank, configured to store liquid; a mounting base, including a leaked liquid buffer structure having a capillary force; and a vaporization core, including a porous substrate and a heating element, where the porous substrate is in fluid communication with the liquid storage tank and absorbs liquid from the liquid storage tank through a capillary force; the heating element heats and vaporizes the liquid of the porous substrate; the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure; and the leaked liquid buffer structure abuts against the porous substrate and is configured to receive the liquid overflowed from the porous substrate. In the vaporizer provided in this application, the leaked liquid buffer structure can collect the liquid leaked from the liquid storage tank, thereby preventing the leaked liquid from leaking out from an air inlet of the vaporizer. According to the provided leaked liquid buffer structure and the vaporization core, the leaked liquid stored in the leaked liquid buffer structure may reflux to the vaporization core through capillary action, to effectively utilize the leaked liquid, and liquid leakage of the vaporizer can be further prevented by repeating the foregoing process for a plurality of times, thereby improving the user experience.

Referring to FIG. 1 , FIG. 2 , and FIG. 3 , FIG. 1 is a schematic structural diagram of an electronic vaporization device according to this application; FIG. 2 is a schematic structural diagram of a vaporizer in an electronic vaporization device according to this application; and FIG. 3 is a three-dimensional enlarged schematic structural diagram of a position A in FIG. 2 . The electronic vaporization device 100 provided in this embodiment includes a vaporizer 10 and a main unit 20. The vaporizer 10 is detachably connected to the main unit 20. The vaporizer 10 specifically includes a liquid storage tank 4, a mounting base 1, and a vaporization core 2. A power supply component is provided in the main unit 20, the vaporizer 10 is inserted in an end opening of one end of the main unit 20, and is connected to the power supply component in the main unit 20, to supply power to the vaporization core 2 in the vaporizer 10 through the power supply component. When the vaporizer 10 needs to be replaced, the vaporizer 10 may be dismounted and a new vaporizer 10 is mounted on the main unit 20, to reuse the main unit 20.

In another optional embodiment, the provided electronic vaporization device 100 includes a liquid storage tank 4, a mounting base 1, a vaporization core 2, and a power supply component. The liquid storage tank 4, the mounting base 1, the vaporization core 2, and the power supply component are integrally provided and cannot be detachably connected to each other.

Certainly, the electronic vaporization device 100 further includes other components such as a microphone and a holder in an existing electronic vaporization device 100. Specific structures and functions of the components are similar to those in the related art, and for details, reference may be made to the related art, which are not described herein again.

The vaporizer 10 provided in the foregoing embodiment includes a liquid storage tank 4, a mounting base 1, and a vaporization core 2. The liquid storage tank 4 is configured to store liquid. In this embodiment, the liquid is e-liquid. The mounting base 1 includes a leaked liquid buffer structure 122 having a capillary force. The vaporization core 2 includes a porous substrate 21 and a heating element 22, where the porous substrate 21 is in fluid communication with the liquid storage tank 4 and absorbs liquid from the liquid storage tank 4 through a capillary force; and the heating element 22 heats and vaporizes the liquid of the porous substrate 21. The vaporization core 2 is located between the liquid storage tank 4 and the leaked liquid buffer structure 122; and the leaked liquid buffer structure 122 abuts against the porous substrate 21 and is configured to receive and store the liquid overflowed from the porous substrate 21.

The vaporizer 10 further includes a seal member 3, and the seal member 3 is provided between the mounting base 1 and the vaporization core 2. The seal member 3 may be a seal ring. The porous substrate 21 is made of any one of a porous ceramic or a porous metal.

The porous substrate 21 is in communication with the liquid storage tank 4 and absorbs liquid from the liquid storage tank 4 through a capillary force; and the heating element 22 is configured to heat and vaporize the liquid of the porous substrate 21.

In an embodiment, the porous substrate 21 includes an e-liquid transmission portion 211 and a protruding portion 212 integrally formed on one side of the e-liquid transmission portion 211, and the leaked liquid buffer structure 122 is in contact with a periphery of one side surface of the e-liquid transmission portion 211 provided with the protruding portion 212. A surface of the protruding portion 212 away from the e-liquid transmission portion 211 is a vaporization surface 214, a surface of the e-liquid transmission portion 211 in contact with e-liquid is a liquid absorbing surface 213, and the leaked liquid buffer structure 122 is in contact with an edge of the side surface of the e-liquid transmission portion 211 provided with the protruding portion 212. That is, the leaked liquid buffer structure 122 is provided in contact with an edge of the e-liquid transmission portion 211 and is provided at intervals with the protruding portion 212, so that the leaked liquid buffer structure 122 can be prevented from being damaged by high temperature of the heating element 22 on the vaporization surface 214. The heating element 22 is provided on the vaporization surface 214. Specifically, the heating element 22 may be a heating film or may be a heating circuit. In a specific embodiment, the heating element 22 is electrically connected to an electrode, and one end of the electrode passes through a foundation base 121 to be connected to the power supply component. Specifically, the e-liquid transmission portion 211 and the protruding portion 212 are integrally formed, and the e-liquid transmission portion 211 and the protruding portion 212 are both made of porous materials. For example, the materials of the e-liquid transmission portion 211 and the protruding portion 212 may be a porous ceramic or a porous metal, but are not limited to the two materials, provided that the e-liquid in the liquid storage tank 4 can be transmitted to the heating element 22 for vaporization through capillary action. The e-liquid transmission portion 211 only covers a part of the leaked liquid buffer structure 122. The capillary force of the porous substrate 21 is greater than the capillary force of the leaked liquid buffer structure 122, and when the heating element 22 heats and vaporizes the liquid of the porous substrate 21, the liquid received by the leaked liquid buffer structure 122 may reflux to the porous substrate 21 and is heated and vaporized.

The mounting base 1 includes the vaporization cavity 125, the vaporization core 2 is accommodated in the vaporization cavity 125, and the leaked liquid buffer structure 122 is connected to the bottom of the vaporization cavity 125 and absorbs liquid deposited at the bottom of the vaporization cavity 125 through a capillary force. The mounting base 1 includes the upper base body 11 and the lower base body 12. The lower base body 12 includes the foundation base 121, the liquid flowing hole 111 is provided on the upper base body 11, the e-liquid in the liquid storage tank 4 flows to the porous substrate 21 through the liquid flowing hole 111. The leaked liquid buffer structure 122 is provided on the lower base body 12, the porous substrate 21 includes the liquid absorbing surface 213 and the vaporization surface 214, the liquid absorbing surface 213 is connected to the liquid flowing hole 111, the heating element 22 is provided on the vaporization surface 214, and the porous substrate 21 is in contact with the leaked liquid buffer structure 122.

When the air pressure in the liquid storage tank 4 increases, the air pressure in the liquid storage tank 4 is greater than the air pressure in the vaporization cavity 125, an air pressure difference between the liquid storage tank 4 and the vaporization cavity 125 presses the liquid in the liquid storage tank 4 to the porous substrate 21, so that redundant liquid overflows from the porous substrate 21, and the leaked liquid buffer structure 122 receives and locks the overflowed redundant liquid. When the air pressure in the liquid storage tank 4 decreases, the air pressure in the liquid storage tank 4 is less than the air pressure in the vaporization cavity 125, the air pressure difference between the liquid storage tank 4 and the vaporization cavity 125 enables the liquid in the leaked liquid buffer structure 122 to reflux to the porous substrate 21 in contact with the leaked liquid buffer structure through capillary action, and the porous substrate 21 refluxes the liquid to the liquid storage tank 4.

In this embodiment, the upper base body 11 and the lower base body 12 are integrally formed. Alternatively, a groove 112 may be provided on the upper base body 11, and a clamp member 124 is provided on an outer side wall of the lower base body 12 and is configured to be clamped to the groove 112 on the upper base body 11, so that the lower base body 12 is fixedly connected to the upper base body 11.

A material of the leaked liquid buffer structure 122 is a porous material, and the porous material may be a hard porous material or may be a soft porous material.

When the material of the leaked liquid buffer structure 122 is a hard porous material, to save space, the leaked liquid buffer structure 122 can be also configured to support the vaporization core 2. The hard porous material is at least one of a porous ceramic or a porous metal, or may be another material with a supporting capability and a liquid absorbing capability.

Referring to FIG. 4 , FIG. 4 is a schematic structural diagram of a first embodiment of a leaked liquid buffer structure according to this application. In a specific embodiment, the leaked liquid buffer structure 122 includes two leaked liquid buffer sub-members 1221 provided at intervals. A material of the leaked liquid buffer sub-member 1221 is a hard porous material, for example, may be a material such as a porous ceramic or a porous metal with a supporting capability and a liquid absorbing capability, so that the leaked liquid buffer sub-member can be used as a support member supporting the vaporization core 2. It may be understood that, if the vaporization core 2 is fixed through another component, the leaked liquid buffer sub-member 1221 may not be configured to support the vaporization core 2. When the air pressure in the liquid storage tank 4 is greater than the air pressure in the vaporization cavity 125, the leaked liquid buffer sub-member 1221 can collect e-liquid leaked from the porous substrate 21. When the air pressure in the liquid storage tank 4 is less than the air pressure in the vaporization cavity 125, the e-liquid stored in the leaked liquid buffer sub-member 1221 can reflux to the porous substrate 21 in contact with the leaked liquid buffer sub-member, to further effectively utilize the leaked e-liquid, so that the leaked liquid buffer structure 122 can implement cyclic collection and reflux of e-liquid for a plurality of times. The liquid absorbing capability of the porous material forming the leaked liquid buffer structure 122 is less than the liquid absorbing capability of the porous material forming the e-liquid transmission portion 211.

Referring to FIG. 5 , FIG. 5 is a schematic structural diagram of a second embodiment of a leaked liquid buffer structure according to this application. In another specific embodiment, the leaked liquid buffer structure 122 is U-shaped and the material thereof is a hard porous material. Specifically, the leaked liquid buffer structure 122 includes a leaked liquid buffer sub-member 1221 and a connecting portion 1222 connected to the leaked liquid buffer sub-member 1221 and away from an end portion of the porous substrate 21. Materials of the leaked liquid buffer sub-member 1221 and the connecting portion 1222 are porous materials, for example, may be materials such as a porous ceramic or a porous metal with a supporting capability and a liquid absorbing capability. A duct matching the air inlet hole 126 provided on the foundation base 121 is provided on the connecting portion 1222. The connecting portion 1222 is configured to absorb condensed e-liquid after vaporized e-liquid in the vaporization cavity 125 formed by the leaked liquid buffer structure 122 and the vaporization core 2 is condensed, to prevent the condensed e-liquid from leaking out through the air inlet hole 126.

Referring to FIG. 6 , FIG. 6 is a schematic structural diagram of a third embodiment of a leaked liquid buffer structure according to this application. A body 123 is provided on the lower base body 12, the body 123 includes a first sub-body 1231 and a second sub-body 1232, and the first sub-body 1231 and the second sub-body 1232 are provided at intervals and symmetrically. The first sub-body 1231 and the second sub-body 1232 may be parallel to each other and perpendicularly provided on the foundation base 121. In another optional embodiment, the first sub-body 1231 and the second sub-body 1232 may be provided on the foundation base 121 obliquely and symmetrically. A distance between the first sub-body 1231 and one end of the second sub-body 1232 away from the foundation base 121 is greater than a distance between the first sub-body 1231 and one end of the second sub-body 1232 connected to the foundation base 121. Materials of the first sub-body 1231 and the second sub-body 1232 are dense ceramics, dense metals, or glass materials, or may be other materials with a supporting capability and without a liquid absorbing capability. In another specific embodiment, the leaked liquid buffer structure 122 is provided on end portions of the first sub-body 1231 and the second sub-body 1232 that are away from the foundation base 121, and the end portions of the first sub-body 1231 and the second sub-body 1232 that are away from the foundation base 121 are connected to the e-liquid transmission portion 211 through the leaked liquid buffer structure 122. The leaked liquid buffer structure 122 may be made of a porous material with a supporting capability and a liquid absorbing capability. For example, the material of the leaked liquid buffer structure 122 may be a material such as a porous ceramic or a porous metal with a supporting capability and a liquid absorbing capability. The leaked liquid buffer structure 122 can collect e-liquid leaked from the e-liquid transmission portion 211 in the leaked liquid buffer structure 122, and can further reflux the e-liquid stored in the leaked liquid buffer structure 122 to the e-liquid transmission portion 211 in contact with the leaked liquid buffer structure 122, to effectively utilize the stored e-liquid, thereby implement cyclic collection and reflux of e-liquid for a plurality of times. The material of the leaked liquid buffer structure 122 may be alternatively a material such as cotton, fiber, or liquid absorbing resin with a liquid absorbing capability and without a supporting capability. The liquid absorbing capability of the porous material forming the leaked liquid buffer structure 122 is less than the liquid absorbing capability of the porous material forming the e-liquid transmission portion 211.

The material of the leaked liquid buffer structure 122 is a soft porous material, the leaked liquid buffer structure 122 is supported by a support portion, so that one end of the leaked liquid buffer structure 122 is in contact with the porous substrate 21, and another end extends to the bottom of the vaporization cavity 125. The soft porous material is at least one of cotton, fiber, or resin, or may be another material with a liquid absorbing capability and without a supporting capability.

Referring to FIG. 7 and FIG. 8 , FIG. 7 is a schematic structural diagram of a fourth embodiment of a leaked liquid buffer structure according to this application; and FIG. 8 is a top view of the leaked liquid buffer structure provided in FIG. 7 . In a specific embodiment, the material of the leaked liquid buffer structure 122 is a soft porous material. The leaked liquid buffer structure 122 is supported by the support portion 127, so that one end of the leaked liquid buffer structure 122 is in contact with the porous substrate 21, and another end extends to the bottom of the vaporization cavity 125. The support portion 127 includes a first support sub-member 1271 and a second support sub-member 1272. An airflow guide channel 1233 is provided on the first support sub-member 1271 and the second support sub-member 1272, the leaked liquid buffer structure 122 is provided in the airflow guide channel 1233, one end of the leaked liquid buffer structure 122 is in contact with the e-liquid transmission portion 211 in the porous substrate 21, and another end extends to the foundation base 121 of the lower base body 12. The airflow guide channel 1233 may be a groove structure, and a size of a groove of the airflow guide channel 1233 is greater than a size of a first capillary groove 1223. An opening of one end of the airflow guide channel 1233 is provided on an inner side wall of each of the first support sub-member 1271 and the second support sub-member 1272, and an opening of another end is located on an end surface of each of the first support sub-member 1271 and the second support sub-member 1272 away from the foundation base 121, and the leaked liquid buffer structure 122 filled in the airflow guide channel 1233 is in contact with the e-liquid transmission portion 211. A size of a cross section of a groove provided on surfaces of the first support sub-member 1271 and the second support sub-member 1272 away from the foundation base 121 is not less than a contact size between the e-liquid transmission portion 211 and the first support sub-member 1271 and the second support sub-member 1272. Specifically, a width of an opening of the airflow guide channel 1233 on the end surfaces of the first support sub-member 1271 and the second support sub-member 1272 in a connecting line direction of the first support sub-member 1271 and the second support sub-member 1272 is not less than a contact width between the first support sub-member 1271 and the second support sub-member 1272 and the e-liquid transmission portion 211 in the connecting line direction of the first support sub-member 1271 and the second support sub-member 1272. The leaked liquid buffer structure 122 is provided in the airflow guide channel 1233 and extends from an end portion of the airflow guide channel 1233. One end of the leaked liquid buffer structure 122 is connected to the e-liquid transmission portion 211, and another end extends between the first support sub-member 1271 and the second support sub-member 1272, or may extend to a surface of the foundation base 121, to collect condensed liquid of the vaporized e-liquid, thereby preventing the vaporized e-liquid from leaking out from the air inlet hole 126 provided on the foundation base 121 after being condensed and affecting the user experience. When the air pressure in the liquid storage tank 4 decreases, the leaked liquid buffer structure 122 may further reflux the collected e-liquid to the e-liquid transmission portion 211 in contact with the leaked liquid buffer structure through capillary action, to effectively utilize the leaked liquid, so that the leaked liquid buffer structure 122 can implement cyclic collection and reflux of e-liquid for a plurality of times. The liquid absorbing capability of the leaked liquid buffer structure 122 is less than the liquid absorbing capability of the e-liquid transmission portion 211. Specifically, the liquid absorbing capability of the porous material forming the leaked liquid buffer structure 122 is less than the liquid absorbing capability of the porous material forming the e-liquid transmission portion 211. The leaked liquid buffer structure 122 may be made of a liquid absorbing material such as cotton, fiber, or liquid absorbing resin.

When a temperature increases, a volume of each bubble in the e-liquid in the liquid storage tank 4 may expand to increase the air pressure in the liquid storage tank 4, and the e-liquid in the vaporization core 2 further leaks from the vaporization core 2 through the end portions of the e-liquid transmission portion 211. The e-liquid leaked from the e-liquid transmission portion 211 can flow to the leaked liquid buffer structure 122 connected to the e-liquid transmission portion 211, the leaked liquid buffer structure 122 is configured to collect the leaked e-liquid, and the e-liquid can penetrate in an extending direction of the leaked liquid buffer structure 122, to prevent the e-liquid from leaking out from the air inlet hole 126. When the temperature decreases, the vaporized e-liquid in the vaporization cavity 125 may form e-liquid through cooling and flow to the foundation base 121, and the e-liquid is collected through the leaked liquid buffer structure 122 extending to the surface of the foundation base 121. Meanwhile, the volume of each bubble in the e-liquid in the liquid storage tank 4 may shrink to decrease the air pressure in the liquid storage tank 4. Since there is an air pressure difference between the inside and the outside of the liquid storage tank 4, the e-liquid collected and stored in the leaked liquid buffer structure 122 flows, along the leaked liquid buffer structure 122, to the e-liquid transmission portion 211 connected to the leaked liquid buffer structure 122 in a direction approaching the e-liquid transmission portion 211 through capillary action, to effectively utilize the collected e-liquid.

Referring to FIG. 9 , FIG. 9 is a schematic structural diagram of a fifth embodiment of a leaked liquid buffer structure according to this application. In a specific embodiment, the leaked liquid buffer structure 122 includes a body 123 and a first capillary groove 1223 provided on the body 123. The first capillary groove 1223 may be provided on any side surface of the body 123, and an opening may face toward any direction, provided that leaked liquid can be absorbed and stored. Preferably, the opening of the first capillary groove 1223 faces toward the vaporization cavity 125. The body 123 is provided on a surface of the foundation base 121 close to the upper base body 11 and is fixedly connected to the foundation base 121, and the body 123 may be provided perpendicular to the surface of the foundation base 121 and integrally formed with the foundation base. One end of the body 123 away from the foundation base 121 is in contact with the e-liquid transmission portion 211, so that the first capillary groove 1223 extends on the body 123 in a direction away from the bottom of the vaporization cavity 125 or the foundation base 121 and is in contact with the e-liquid transmission portion 211, and another end of the body extends in a direction approaching the bottom of the vaporization cavity 125 or the foundation base 121. The first capillary groove 1223 is configured to store leaked liquid leaked from the e-liquid transmission portion 211 and reflux the leaked liquid to the liquid storage tank 4, to further prevent liquid leakage and effectively utilize the stored leaked liquid.

A plurality of first capillary grooves 1223 are provided on a surface of a side wall of each of the first sub-body 1231 and the second sub-body 1232 close to the vaporization cavity 125, and the plurality of first capillary grooves 1223 provided side by side form the leaked liquid buffer structure 122. Specifically, a cross section of the first capillary groove 1223 may be in a shape of U, or may be in a shape of V, a semi-circle, a semi-ellipse, or n. The shape of the cross section is not limited herein, provided that the shape can facilitate liquid guiding and collection. In an optional embodiment, a size of the first capillary groove 1223 is not less than a contact size between the first capillary groove 1223 and the vaporization core 2. The size is a width in a direction of the first sub-body 1231 and the second sub-body 1232.

The bottom of the vaporization cavity 125 is a surface of the foundation base 121 connected to the leaked liquid buffer structure 122. The surface of the foundation base 121 connected to the leaked liquid buffer structure 122 is provided with a second capillary groove 1224. The second capillary groove 1224 is provided on the surface of the foundation base 121 between the first sub-body 1231 and the second sub-body 1232 and is in communication with the first capillary groove 1223. The first capillary groove 1223 and the second capillary groove 1224 form an L-shaped capillary groove. Specifically, a shape of a cross section of the second capillary groove 1224 is the same as the shape of the cross section of the first capillary groove 1223, and may be alternatively different from that of the first capillary groove. There may be one second capillary groove 1224, namely, one second capillary groove 1224 is in communication with all first capillary grooves 1223 on the first sub-body 1231 or the second sub-body 1232. The quantity of the second capillary grooves 1224 may be the same as the quantity of the first capillary grooves 1223, namely, one first capillary groove 1223 is in communication with one corresponding second capillary groove 1224. The first capillary groove 1223 can allow e-liquid leaked from end portions of the e-liquid transmission portion 211 to flow to the second capillary groove 1224 in an extending direction of the first capillary groove 1223, to store the leaked e-liquid and prevent the e-liquid from leaking out from the air inlet hole 126 provided on the foundation base 121. The second capillary groove 1224 may further collect condensed liquid after vaporized e-liquid is cooled, to prevent the vaporized e-liquid from leaking out from the air inlet hole 126 provided on the foundation base 121 after being condensed and affecting the user experience. The first capillary groove 1223 may further reflux the collected e-liquid to the e-liquid transmission portion 211 in contact with the first capillary groove through capillary action, to effectively utilize the collected leaked liquid. The liquid absorbing capabilities of the first capillary groove 1223 and the second capillary groove 1224 are less than the liquid absorbing capability of the e-liquid transmission portion 211. Specifically, the liquid absorbing capabilities of the first capillary groove 1223 and the second capillary groove 1224 are less than the liquid absorbing capability of the porous material forming the e-liquid transmission portion 211.

In another specific embodiment, the leaked liquid buffer structure 122 is further configured to support the vaporization core 2. Specifically, to save space, the first sub-body 1231 and the second sub-body 1232 provided with the first capillary groove 1223 are further configured to support the vaporization core 2. One end of each of the first sub-body 1231 and the second sub-body 1232 away from the foundation base 121 is configured to support the vaporization core 2. The e-liquid transmission portion 211 covers an end portion of each of the first sub-body 1231 and the second sub-body 1232 away from the foundation base 121, and the protruding portion 212 provided on one side of the e-liquid transmission portion 211 is provided between the first sub-body 1231 and the second sub-body 1232.

Referring to FIG. 10 , FIG. 10 is a schematic phenomenon diagram of a vaporizer in a heating process according to this application. With an increase in the temperature, a volume of each bubble in the e-liquid in the liquid storage tank 4 may expand to increase the air pressure in the liquid storage tank 4, and the e-liquid in the vaporization core 2 further leaks from the vaporization core 2 through the end portions of the e-liquid transmission portion 211. The e-liquid leaked from the end portions of the e-liquid transmission portion 211 can flow to the first capillary groove 1223 connected to the e-liquid transmission portion 211, the leaked e-liquid is collected by the first capillary groove 1223, the e-liquid can flow to the second capillary groove 1224 along the first capillary groove 1223 provided on the first sub-body 1231 and the second sub-body 1232, and the leaked e-liquid is collected by the first capillary groove 1223 and the second capillary groove 1224, to prevent the leaked e-liquid from leaking out from the air inlet hole 126. Referring to FIG. 11 , FIG. 11 is a schematic phenomenon diagram of a vaporizer in a cooling process according to this application. With a decrease in the temperature, the vaporized e-liquid in the vaporization cavity 125 formed by the first sub-body 1231, the second sub-body 1232, the foundation base 121, and the vaporization core 2 may be cooled to form e-liquid and then flows to the foundation base 121, and the e-liquid is collected by the second capillary groove 1224.

Meanwhile, the volume of each bubble in the e-liquid in the liquid storage tank 4 may shrink to decrease the air pressure in the liquid storage tank 4. Since there is an air pressure difference between the inside and the outside of the liquid storage tank 4, the e-liquid collected and stored in the first capillary groove 1223 and the second capillary groove 1224 flows, along the first capillary groove 1223, to the e-liquid transmission portion 211 connected to the first capillary groove 1223 in a direction away from the second capillary groove 1224 through capillary action. The liquid absorbing capability of the e-liquid transmission portion 211 is greater than the liquid absorbing capabilities of the first capillary groove 1223 and the second capillary groove 1224, so that the e-liquid transmission portion 211 can absorb the e-liquid and effectively utilize the collected e-liquid.

Referring to FIG. 12 , FIG. 12 is a schematic structural diagram of a sixth embodiment of a leaked liquid buffer structure according to this application. The leaked liquid buffer structure 122 includes a body 123 and a capillary hole 1225 provided on the body 123. A plurality of capillary holes 1225 are provided on the first sub-body 1231 and the second sub-body 1232. One end of the capillary hole 1225 extends on the body 123 in a direction away from the bottom of the vaporization cavity 125 and is in contact with the porous substrate 21, and another end of the capillary hole extends in a direction approaching the bottom of the vaporization cavity 125. Specifically, a cross section of the capillary hole 1225 may be in a shape of a rectangle, or may be in a shape of a triangle, a circle, a semi-circle, or a semi-ellipse. The shape of the cross section is not limited herein, provided that the shape can facilitate liquid guiding and collection. In an optional embodiment, a distribution width of the capillary hole 1225 on an end surface of each of the first sub-body 1231 and the second sub-body 1232 in contact with the porous substrate 21 is not less than a contact width between the first sub-body 1231 and the second sub-body 1232 and the porous substrate 21. The width is a width in a connecting line direction of the first sub-body 1231 and the second sub-body 1232. A second capillary groove 1224 is provided on a surface of the foundation base 121 connected to the body 123. The second capillary groove 1224 is provided on a surface of the foundation base 121 between the first sub-body 1231 and the second sub-body 1232 and is in communication with the capillary hole 1225. Specifically, a cross section of the second capillary groove 1224 may be in a shape of U, or may be in a shape of V, a semi-circle, a semi-ellipse, or n. The shape of the cross section is not limited herein, provided that the shape can facilitate collection. There may be one second capillary groove 1224, namely, one second capillary groove 1224 is in communication with all capillary holes 1225 on the first sub-body 1231 or the second sub-body 1232. The quantity of the second capillary grooves 1224 may be the same as the quantity of the capillary holes 1225, namely, one capillary hole 1225 is in communication with one corresponding second capillary groove 1224. The leaked e-liquid can flow to the second capillary groove 1224 along the capillary hole 1225, to store the leaked e-liquid and prevent the e-liquid from leaking out from the air inlet hole 126 provided on the foundation base 121. The second capillary groove 1224 may further collect condensed liquid after vaporized e-liquid is cooled, to prevent the vaporized e-liquid from leaking out from the air inlet hole 126 provided on the foundation base 121 after being condensed and affecting the user experience. The capillary hole 1225 may further reflux the collected e-liquid to the e-liquid transmission portion 211 in contact with the capillary hole through capillary action, to effectively utilize the collected leaked liquid and prolong a service life of the second capillary groove 1224. The liquid absorbing capabilities of the capillary hole 1225 and the second capillary groove 1224 are less than the liquid absorbing capability of the e-liquid transmission portion 211. Specifically, the liquid absorbing capabilities of the capillary hole 1225 and the second capillary groove 1224 are less than the liquid absorbing capability of the porous material forming the e-liquid transmission portion 211.

When a temperature increases, a volume of each bubble in the e-liquid in the liquid storage tank 4 may expand to increase the air pressure in the liquid storage tank 4, and the e-liquid in the vaporization core 2 further leaks from the vaporization core 2 through the end portions of the e-liquid transmission portion 211. The e-liquid leaked from the e-liquid transmission portion 211 can flow to the capillary hole 1225 connected to the e-liquid transmission portion 211, the leaked e-liquid is collected by the capillary hole 1225, the e-liquid can flow to the second capillary groove 1224 along the capillary hole 1225 provided on the first sub-body 1231 and the second sub-body 1232, and the leaked e-liquid is collected by the capillary hole 1225 and the second capillary groove 1224, to prevent the leaked e-liquid from leaking out from the air inlet hole 126. When the temperature decreases, the vaporized e-liquid in the vaporization cavity 125 may form e-liquid through cooling and flow to the foundation base 121, and the e-liquid is collected through the second capillary groove 1224. Meanwhile, the volume of each bubble in the e-liquid in the liquid storage tank 4 may shrink to decrease the air pressure in the liquid storage tank 4. Since there is an air pressure difference between the inside and the outside of the liquid storage tank 4, the e-liquid collected and stored in the capillary hole 1225 and the second capillary groove 1224 flows, along the capillary hole 1225, to the e-liquid transmission portion 211 connected to the capillary hole 1225 in a direction away from the second capillary groove 1224 through capillary action. The liquid absorbing capability of the e-liquid transmission portion 211 is greater than the liquid absorbing capabilities of the capillary hole 1225 and the second capillary groove 1224, so that the e-liquid transmission portion 211 can absorb the e-liquid and effectively utilize the collected e-liquid.

In another optional embodiment, the leaked liquid buffer structure 122 includes a first capillary groove 1223 and a soft porous material. The soft porous material is filled in the first capillary groove 1223, and the liquid absorbing capabilities of the first capillary groove 1223 and the soft porous material are less than the liquid absorbing capability of the porous substrate 21.

In another optional embodiment, the leaked liquid buffer structure 122 includes a capillary hole 1225 and a soft porous material. The soft porous material is filled in the capillary hole 1225, and the liquid absorbing capabilities of the capillary hole 1225 and the soft porous material are less than the liquid absorbing capability of the porous substrate 21.

The vaporizer provided in this embodiment includes: a liquid storage tank, configured to store liquid; a mounting base, including a leaked liquid buffer structure having a capillary force; and a vaporization core, including a porous substrate and a heating element, where the porous substrate is in fluid communication with the liquid storage tank and absorbs liquid from the liquid storage tank through a capillary force; the heating element heats and vaporizes the liquid of the porous substrate; the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure; and the leaked liquid buffer structure abuts against the porous substrate and is configured to receive the liquid overflowed from the porous substrate. In the vaporizer provided in this application, the leaked liquid buffer structure can collect the liquid leaked from the liquid storage tank, thereby preventing the leaked liquid from leaking out from an air inlet of the vaporizer. According to the provided leaked liquid buffer structure and the vaporization core, the leaked liquid stored in the leaked liquid buffer structure may reflux to the vaporization core through capillary action, to effectively utilize the leaked liquid, and liquid leakage of the vaporizer can be further prevented by repeating the foregoing process for a plurality of times, thereby improving the user experience.

The foregoing descriptions are merely implementations of this application, and the patent scope of this application is not limited thereto. All equivalent structure or process changes made according to the content of this specification and accompanying drawings in this application or by directly or indirectly applying this application in other related technical fields shall fall within the protection scope of this application.

While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. It will be understood that changes and modifications may be made by those of ordinary skill within the scope of the following claims. In particular, the present invention covers further embodiments with any combination of features from different embodiments described above and below. Additionally, statements made herein characterizing the invention refer to an embodiment of the invention and not necessarily all embodiments.

The terms used in the claims should be construed to have the broadest reasonable interpretation consistent with the foregoing description. For example, the use of the article “a” or “the” in introducing an element should not be interpreted as being exclusive of a plurality of elements. Likewise, the recitation of “or” should be interpreted as being inclusive, such that the recitation of “A or B” is not exclusive of “A and B,” unless it is clear from the context or the foregoing description that only one of A and B is intended. Further, the recitation of “at least one of A, B and C” should be interpreted as one or more of a group of elements consisting of A, B and C, and should not be interpreted as requiring at least one of each of the listed elements A, B and C, regardless of whether A, B and C are related as categories or otherwise. Moreover, the recitation of “A, B and/or C” or “at least one of A, B or C” should be interpreted as including any singular entity from the listed elements, e.g., A, any subset from the listed elements, e.g., A and B, or the entire list of elements A, B and C. 

What is claimed is:
 1. A vaporizer, comprising: a liquid storage tank configured to store liquid; a mounting base comprising a leaked liquid buffer structure having a capillary force; and a vaporization core comprising a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and configured to absorb liquid from the liquid storage tank through a capillary force, the heating element being configured to heat and vaporize the liquid of the porous substrate, wherein the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure, and wherein the leaked liquid buffer structure abuts the porous substrate and is configured to receive the liquid overflowed from the porous substrate.
 2. The vaporizer of claim 1, wherein the capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and wherein, when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.
 3. The vaporizer of claim 1, wherein the mounting base comprises a vaporization cavity, wherein the vaporization core is accommodated in the vaporization cavity, and wherein the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and is configured to absorb liquid deposited at the bottom of the vaporization cavity through a capillary force.
 4. The vaporizer of claim 1, wherein the mounting base comprises an upper base body and a lower base body, a liquid flowing hole being provided on the upper base body, wherein the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole, wherein the leaked liquid buffer structure is provided on the lower base body, wherein the porous substrate comprises a liquid absorbing surface and a vaporization surface, the liquid absorbing surface being connected to the liquid flowing hole, wherein the heating element is provided on the vaporization surface, and wherein surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.
 5. The vaporizer of claim 1, wherein, when an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate such that the porous substrate overflows redundant liquid, and wherein the leaked liquid buffer structure is configured to receive and lock the redundant liquid, and wherein, when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate.
 6. The vaporizer of claim 1, wherein the leaked liquid buffer structure comprises a first capillary groove, one end of the first capillary groove being in contact with the porous substrate, and an other end of the first capillary groove extending to the bottom of the vaporization cavity.
 7. The vaporizer of claim 6, wherein the leaked liquid buffer structure further comprises a second capillary groove provided on the bottom of the vaporization cavity, and wherein the second capillary groove is in communication with the first capillary groove.
 8. The vaporizer of claim 1, wherein the leaked liquid buffer structure comprises a capillary hole, one end of the capillary hole being in contact with the porous substrate, and an other end of the capillary hole extending to the bottom of the vaporization cavity.
 9. The vaporizer of claim 8, wherein the leaked liquid buffer structure further comprises a second capillary groove provided on the bottom of the vaporization cavity, and wherein the second capillary groove is in communication with the capillary hole.
 10. The vaporizer of claim 1, wherein a material of the leaked liquid buffer structure comprises a porous material.
 11. The vaporizer of claim 10, wherein the porous material comprises a hard porous material, and wherein the leaked liquid buffer structure is configured to support the vaporization core.
 12. The vaporizer of claim 11, wherein the leaked liquid buffer structure comprises a U-shaped structure.
 13. The vaporizer of claim 11, wherein the hard porous material comprises at least one of a porous ceramic or a porous metal.
 14. The vaporizer of claim 10, wherein the porous material comprises a soft porous material, and wherein the leaked liquid buffer structure is supported by a support portion such that one end of the leaked liquid buffer structure is in contact with the porous substrate, and an other end extends to the bottom of the vaporization cavity.
 15. The vaporizer of claim 14, wherein the soft porous material comprises at least one of cotton, fiber, or liquid absorbing resin.
 16. The vaporizer of claim 1, wherein the porous substrate comprises an e-liquid transmission portion and a protruding portion integrally formed on one side of the e-liquid transmission portion, and wherein the leaked liquid buffer structure is provided on an edge of the e-liquid transmission portion and provided at intervals with the protruding portion.
 17. The vaporizer of claim 1, wherein the porous substrate comprises a porous ceramic or a porous metal.
 18. An electronic vaporization device, comprising: a power supply component; and the vaporizer of claim
 1. 19. An electronic vaporization device, comprising: a liquid storage tank configured to store liquid; a mounting base comprising a leaked liquid buffer structure having a capillary force; a vaporization core comprising a porous substrate and a heating element, the porous substrate being in fluid communication with the liquid storage tank and configured to absorb liquid from the liquid storage tank through a capillary force, and the heating element being configured to heat and vaporizing the liquid of the porous substrate; and a power supply component configured to supply power to the vaporization core, wherein the vaporization core is located between the liquid storage tank and the leaked liquid buffer structure, and wherein the leaked liquid buffer structure abuts the porous substrate and is configured to receive the liquid overflowed from the porous substrate.
 20. The electronic vaporization device of claim 19, wherein the capillary force of the porous substrate is greater than the capillary force of the leaked liquid buffer structure, and wherein, when the heating element heats and vaporizes the liquid of the porous substrate, the liquid received by the leaked liquid buffer structure refluxes to the porous substrate and is heated and vaporized.
 21. The electronic vaporization device of claim 19, wherein the mounting base comprises a vaporization cavity, wherein the vaporization core is accommodated in the vaporization cavity, and wherein the leaked liquid buffer structure is connected to a bottom of the vaporization cavity and configured to absorb liquid deposited at the bottom of the vaporization cavity through a capillary force.
 22. The electronic vaporization device of claim 19, wherein the mounting base comprises an upper base body and a lower base body, a liquid flowing hole being provided on the upper base body is provided with, wherein the liquid in the liquid storage tank flows to the porous substrate through the liquid flowing hole, wherein the leaked liquid buffer structure is provided on the lower base body, wherein the porous substrate comprises a liquid absorbing surface and a vaporization surface provided opposite to each other, the liquid absorbing surface being connected to the liquid flowing hole, the heating element being provided on the vaporization surface, and wherein surfaces other than the liquid absorbing surface and the vaporization surface of the porous substrate are in contact with the leaked liquid buffer structure.
 23. The electronic vaporization device of claim 19, wherein, when an air pressure in the liquid storage tank increases, the liquid is pressed to overflow to the porous substrate such that the porous substrate overflows redundant liquid, wherein the leaked liquid buffer structure is configured to receive and lock the redundant liquid, and wherein, when the air pressure in the liquid storage tank decreases, the redundant liquid refluxes to the liquid storage tank through the porous substrate. 